Componenti per Raffreddamento a Liquido
Piastra di raffreddamento a liquido in rame puro microcanale con alette skived personalizzata per chip AI e GPU da 1000W+
Piastra di raffreddamento a liquido microcanale in rame puro con alette skived ad alte prestazioni per acceleratori AI e server GPU da 1000W+. Brasata sotto vuoto, zero perdite garantite. Richiedi un preventivo DFM.
Vantaggi di processo e consegna
- Supporta tolleranze di ±0,01 mm, con copertura completa di centri di lavoro CNC a 3/4/5 assi
- Materiali inclusi lega di alluminio, acciaio inossidabile, rame, lega di titanio e materie plastiche tecniche
- Abbinato a anodizzazione, galvanica, verniciatura, incisione laser e altri trattamenti superficiali
- Ispezione completa al 100% prima della spedizione, con report del primo articolo e dati dimensionali CP/CPK forniti
- Capacità produttiva interna a Dongguan, 7-15 giorni per parti standard, canale rapido entro 5 giorni
PANORAMICA DEL PRODOTTO
Panoramica del prodotto
Product Overview
Engineered specifically for next-generation 1000W+ AI accelerators, GPU clusters, and high-heat-flux ASIC processors, the Custom Skived Fin Microchannel Pure Copper Liquid Cold Plate (Model: LC-CU-01) sets the benchmark for extreme thermal dissipation. Utilizing monolithic skived fin machining from ultra-pure oxygen-free copper (C11000 / Cu-ETP), this cold plate eliminates interface thermal resistance between fins and baseplate. Coupled with hermetic vacuum brazing and mirror-polished chip contact zones, it delivers industry-leading low thermal impedance (< 0.008 °C/W) while maintaining zero leakage under rigorous operating pressures.
Technical Specifications
| Technical Parameter | Design Specification & Standard |
|---|---|
| Base & Fin Material | Oxygen-Free High Conductivity Copper C11000 / Cu-OFE (≥ 99.95% Purity) |
| Fin Forming & Assembly Process | Integral Precision Skiving Process & High-Vacuum Brazing (Flux-Free) |
| Microchannel Dimensions | Fin Thickness: 0.15mm ~ 0.25mm | Fin Pitch: 0.20mm ~ 0.35mm | Aspect Ratio up to 18:1 |
| Thermal Dissipation Capacity | Supports 800W ~ 1500W+ TDP | Heat Flux Handling ≥ 120 W/cm² |
| Die Contact Flatness & Roughness | Flatness ≤ 0.015 mm across die mounting zone | Surface Roughness Ra ≤ 0.2 μm |
| Machining Tolerance Class | ±0.01mm (Strict ISO 2768-m / IT6 Precision CNC Milling) |
| Leakage Testing Standard | 100% Helium Mass Spectrometer Vacuum Leak Tested ≤ 1×10−9 mbar·L/s |
| Pressure Rating | Operating: 1.5 MPa (217 psi) | Proof Pressure: 3.5 MPa (507 psi) zero deformation |
| Surface Protection | Electroless Nickel Plating (ENIG / Ni-P 3-5 μm) or Anti-Oxidation Passivation |
Core Engineering & Manufacturing Advantages
- Monolithic Integral Skived Structure: Skived directly from continuous copper billets, achieving 100% metallurgical continuity without thermal bonding pastes or solder joints, maximizing conductive heat transfer into fluid streams.
- Ultra-Dense Microchannel Geometry: Enables fin pitches as tight as 0.2mm with aspect ratios exceeding 15:1, yielding up to 600% more active wetted surface area compared to conventional CNC-slotted plates.
- Flux-Free Vacuum Brazed Enclosure: High-vacuum brazing at 10⁻⁴ Pa ensures ultra-clean internal fluid circuits without chemical flux residue, preventing coolant fouling and galvanic corrosion in closed-loop server racks.
- Direct Die Mirror Finishing: Multi-axis ultra-precision fly-cutting achieves Ra ≤ 0.2 μm surface roughness and 0.015 mm flatness, dramatically reducing thermal grease/TIM bond line thickness.
- Agile Fast-Turn Prototyping: Dedicated prototype engineering cells provide full DFM thermal simulations within 24 hours and custom physical prototypes in 7 to 10 working days.
Frequently Asked Questions (FAQs)
Q1: Can Altus Precision customize microchannel copper cold plates for proprietary GPU/ASIC footprints?
A: Yes. More than 85% of our liquid cooling production is customized build-to-print. Customers provide 3D CAD models (STEP/IGES) and thermal boundary requirements; our engineering team conducts CFD flow and thermal simulations to optimize channel layout and inlet/outlet port locations.
Q2: How do you guarantee zero leakage in high-density server rack environments?
A: 100% of manufactured cold plates undergo helium mass spectrometer leak testing with a rejection threshold of ≤ 1×10−9 mbar·L/s, followed by hydrostatic proof pressure testing up to 3.5 MPa. Full FAI inspection reports and leak test certificates are included with each lot.
Q3: What coolants and quick disconnect fittings are supported?
A: With electroless nickel plating, the cold plate is fully compatible with deionized water, ethylene/propylene glycol-water solutions (EGW/PGW), and synthetic dielectric liquids. Fittings support standard G1/4", G3/8", NPT threads, quick-disconnect couplers (QDC), or custom stainless steel brazed barb tubes.
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Comunicaci i tuoi disegni, le quantità e i requisiti di consegna. Il nostro team tecnico fornirà un piano di processo e un preventivo entro 24 ore.
Emailinfo@altusprecision.com
Telefono+86 13418313631
WhatsApp+86 13418313631
IndirizzoDongguan, Guangdong, Cina