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Liquid Cooling Components

Custom Skived Fin Microchannel Pure Copper Liquid Cold Plate for 1000W+ AI & GPU Chips

Name: Custom Precision CNC Machined Parts
Brand: Altus Precision
SKU: ALTUS-CNC-CUSTOM
Availability: InStock
Rating: 4.8 (47 reviews)

High-performance skived fin pure copper microchannel liquid cold plate for 1000W+ AI accelerators and GPU servers. Vacuum brazed, zero leakage guaranteed. Get DFM quote.

Model

LC-CU-01

MOQ

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Process & Delivery Advantages

Supports ±0.01mm tolerance, with full coverage of 3/4/5-axis CNC machining centers
Materials include aluminum alloy, stainless steel, copper, titanium alloy, and engineering plastics
Paired with anodizing, electroplating, spraying, laser engraving, and other surface treatments
100% full inspection before shipment, with first-article reports and dimensional CP/CPK data provided
In-house capacity in Dongguan, 7-15 days for standard parts, expedited channel within 5 days

PRODUCT OVERVIEW

Product Overview

Engineered specifically for next-generation 1000W+ AI accelerators, GPU clusters, and high-heat-flux ASIC processors, the Custom Skived Fin Microchannel Pure Copper Liquid Cold Plate (Model: LC-CU-01) sets the benchmark for extreme thermal dissipation. Utilizing monolithic skived fin machining from ultra-pure oxygen-free copper (C11000 / Cu-ETP), this cold plate eliminates interface thermal resistance between fins and baseplate. Coupled with hermetic vacuum brazing and mirror-polished chip contact zones, it delivers industry-leading low thermal impedance (< 0.008 °C/W) while maintaining zero leakage under rigorous operating pressures.

Technical Specifications

Technical Parameter	Design Specification & Standard
Base & Fin Material	Oxygen-Free High Conductivity Copper C11000 / Cu-OFE (≥ 99.95% Purity)
Fin Forming & Assembly Process	Integral Precision Skiving Process & High-Vacuum Brazing (Flux-Free)
Microchannel Dimensions	Fin Thickness: 0.15mm ~ 0.25mm \| Fin Pitch: 0.20mm ~ 0.35mm \| Aspect Ratio up to 18:1
Thermal Dissipation Capacity	Supports 800W ~ 1500W+ TDP \| Heat Flux Handling ≥ 120 W/cm²
Die Contact Flatness & Roughness	Flatness ≤ 0.015 mm across die mounting zone \| Surface Roughness Ra ≤ 0.2 μm
Machining Tolerance Class	±0.01mm (Strict ISO 2768-m / IT6 Precision CNC Milling)
Leakage Testing Standard	100% Helium Mass Spectrometer Vacuum Leak Tested ≤ 1×10−9 mbar·L/s
Pressure Rating	Operating: 1.5 MPa (217 psi) \| Proof Pressure: 3.5 MPa (507 psi) zero deformation
Surface Protection	Electroless Nickel Plating (ENIG / Ni-P 3-5 μm) or Anti-Oxidation Passivation

Core Engineering & Manufacturing Advantages

Monolithic Integral Skived Structure: Skived directly from continuous copper billets, achieving 100% metallurgical continuity without thermal bonding pastes or solder joints, maximizing conductive heat transfer into fluid streams.
Ultra-Dense Microchannel Geometry: Enables fin pitches as tight as 0.2mm with aspect ratios exceeding 15:1, yielding up to 600% more active wetted surface area compared to conventional CNC-slotted plates.
Flux-Free Vacuum Brazed Enclosure: High-vacuum brazing at 10⁻⁴ Pa ensures ultra-clean internal fluid circuits without chemical flux residue, preventing coolant fouling and galvanic corrosion in closed-loop server racks.
Direct Die Mirror Finishing: Multi-axis ultra-precision fly-cutting achieves Ra ≤ 0.2 μm surface roughness and 0.015 mm flatness, dramatically reducing thermal grease/TIM bond line thickness.
Agile Fast-Turn Prototyping: Dedicated prototype engineering cells provide full DFM thermal simulations within 24 hours and custom physical prototypes in 7 to 10 working days.

Frequently Asked Questions (FAQs)

Q1: Can Altus Precision customize microchannel copper cold plates for proprietary GPU/ASIC footprints?

A: Yes. More than 85% of our liquid cooling production is customized build-to-print. Customers provide 3D CAD models (STEP/IGES) and thermal boundary requirements; our engineering team conducts CFD flow and thermal simulations to optimize channel layout and inlet/outlet port locations.

Q2: How do you guarantee zero leakage in high-density server rack environments?

A: 100% of manufactured cold plates undergo helium mass spectrometer leak testing with a rejection threshold of ≤ 1×10−9 mbar·L/s, followed by hydrostatic proof pressure testing up to 3.5 MPa. Full FAI inspection reports and leak test certificates are included with each lot.

Q3: What coolants and quick disconnect fittings are supported?

A: With electroless nickel plating, the cold plate is fully compatible with deionized water, ethylene/propylene glycol-water solutions (EGW/PGW), and synthetic dielectric liquids. Fittings support standard G1/4", G3/8", NPT threads, quick-disconnect couplers (QDC), or custom stainless steel brazed barb tubes.