Tấm Làm Mát Chất Lỏng Bằng Đồng Nguyên Chất Vi Kênh Vây Bào Tùy Chỉnh cho Chip AI & GPU 1000W+

Product Overview

Engineered specifically for next-generation 1000W+ AI accelerators, GPU clusters, and high-heat-flux ASIC processors, the Custom Skived Fin Microchannel Pure Copper Liquid Cold Plate (Model: LC-CU-01) sets the benchmark for extreme thermal dissipation. Utilizing monolithic skived fin machining from ultra-pure oxygen-free copper (C11000 / Cu-ETP), this cold plate eliminates interface thermal resistance between fins and baseplate. Coupled with hermetic vacuum brazing and mirror-polished chip contact zones, it delivers industry-leading low thermal impedance (< 0.008 °C/W) while maintaining zero leakage under rigorous operating pressures.

Technical Specifications

Core Engineering & Manufacturing Advantages

• Monolithic Integral Skived Structure: Skived directly from continuous copper billets, achieving 100% metallurgical continuity without thermal bonding pastes or solder joints, maximizing conductive heat transfer into fluid streams.
• Ultra-Dense Microchannel Geometry: Enables fin pitches as tight as 0.2mm with aspect ratios exceeding 15:1, yielding up to 600% more active wetted surface area compared to conventional CNC-slotted plates.
• Flux-Free Vacuum Brazed Enclosure: High-vacuum brazing at 10⁻⁴ Pa ensures ultra-clean internal fluid circuits without chemical flux residue, preventing coolant fouling and galvanic corrosion in closed-loop server racks.
• Direct Die Mirror Finishing: Multi-axis ultra-precision fly-cutting achieves Ra ≤ 0.2 μm surface roughness and 0.015 mm flatness, dramatically reducing thermal grease/TIM bond line thickness.
• Agile Fast-Turn Prototyping: Dedicated prototype engineering cells provide full DFM thermal simulations within 24 hours and custom physical prototypes in 7 to 10 working days.